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 NSL12AW High Current Surface Mount PNP Silicon Low VCE(sat) Transistor for Battery Operated Applications
Features: http://onsemi.com
* * * *
High Current Capability (3 A) High Power Handling (Up to 650 mW) Low VCE(s) (170 mV Typical @ 1 A) Small Size
12 VOLTS 3.0 AMPS PNP TRANSISTOR
Benefits:
* High Specific Current and Power Capability Reduces Required PCB Area * Reduced Parasitic Losses Increases Battery Life
MAXIMUM RATINGS (TA = 25C)
Rating Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current - Continuous Collector Current - Peak Electrostatic Discharge Symbol VCEO VCBO VEBO IC ICM ESD Max -12 -12 -5.0 -2.0 -3.0 Unit Vdc Vdc Vdc Adc 6 3 BASE
COLLECTOR 1, 2, 5, 6
4 EMITTER
5
4
HBM Class 3 MM Class C 1
2
3
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Lead 6 Total Device Dissipation (Single Pulse < 10 sec.) Junction and Storage Temperature Range 1. FR-4, Minimum Pad, 1 oz Coverage 2. FR-4, 1 Pad, 1 oz Coverage Symbol PD (Note 1) Max 450 3.6 RJA (Note 1) PD (Note 2) 275 650 5.2 RJA (Note 2) RJL PD Single TJ, Tstg 192 105 1.4 -55 to +150 Unit mW mW/C C/W
CASE 419B SOT-363/SC-88 STYLE 20
DEVICE MARKING
mW mW/C C/W C/W W C 11d
11 = Specific Device Code d = Date Code
ORDERING INFORMATION
Device NSL12AWT1 Package SOT-416 Shipping 3000/Tape & Reel
(c) Semiconductor Components Industries, LLC, 2002
1
April, 2002 - Rev. 1
Publication Order Number: NSL12AW/D
NSL12AW
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Characteristic Symbol Min Typical Max Unit
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage (IC = -10 mAdc, IB = 0) Collector-Base Breakdown Voltage (IC = -0.1 mAdc, IE = 0) Emitter-Base Breakdown Voltage (IE = -0.1 mAdc, IC = 0) Collector Cutoff Current (VCB = -12 Vdc, IE = 0) Collector-Emitter Cutoff Current (VCES = -12 Vdc, IE = 0) Emitter Cutoff Current (VCES = -5.0 Vdc, IE = 0) V(BR)CEO -12 V(BR)CBO -12 V(BR)EBO -5.0 ICBO - ICES - IEBO - -0.03 -0.1 -0.03 -0.1 mAdc -0.02 -0.1 mAdc -7.0 - mAdc -25 - Vdc -15 - Vdc Vdc
ON CHARACTERISTICS
DC Current Gain (Note 3) (IC = -0.5 A, VCE = -1.5 V) (IC = -0.8 A, VCE = -1.5 V) (IC = -1.0 A, VCE = -1.5 V) Collector-Emitter Saturation Voltage (Note 3) (IC = -0.5 A, IB = -10 mA) (IC = -0.8 A, IB = -16 mA) (IC = -1.0 A, IB = -20 mA) Base-Emitter Saturation Voltage (Note 3) (IC = -1.0 A, IB = -20 mA) Base-Emitter Turn-on Voltage (Note 3) (IC = -1.0 A, VCE = -1.5 V) Cutoff Frequency (IC = -100 mA, VCE = -5.0 V, f = 100 MHz) Output Capacitance (VCB = -1.5 V, f = 1.0 MHz) 3. Pulsed Condition: Pulse Width < 300 msec, Duty Cycle < 2% hFE 100 100 100 VCE(sat) - - - VBE(sat) - VBE(on) - fT - Cobo - 50 65 100 - pF -0.81 -0.95 MHz -0.84 -0.95 V -0.10 -0.14 -0.17 -0.160 -0.235 -0.290 V 180 165 160 - 300 - V
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2
NSL12AW
VCE, COLLECTOR EMITTER VOLTAGE (V) 0.5 VCE, COLLECTOR EMITTER VOLTAGE (V) 0.5
0.4 2A 0.3
0.4
0.3
0.2
1A 800 mA IC = 100 mA 500 mA 10 IB, BASE CURRENT (mA) 100
0.2
IC/IB = 100
0.1 0 1
0.1 0 0.001 0.01 0.1 IC/IB = 10 1 IC, COLLECTOR CURRENT (AMPS)
Figure 1. Collector Emitter Voltage versus Base Current
Figure 2. Collector Emitter Voltage versus Collector Current
400 125C hFE, DC CURRENT GAIN 300 VBE, BASE EMITTER VOLTAGE (V) VCE = 1.5 V
1.0 0.9 0.8 0.7 25C 0.6 0.5 0.4 0.3 0.001 0.01 0.1 1 0.001 0.01 0.1 IC, COLLECTOR CURRENT (AMPS) 125C VCE = 1.5 V 1 TA = -55C
200
25C
100
TA = -55C
0
IC, COLLECTOR CURRENT (AMPS)
VBE(sat), BASE EMITTER SATURATION VOLTAGE (V)
Figure 3. DC Current Gain versus Collector Current
Figure 4. Base Emitter Voltage versus Collector Current
1.0 IC, COLLECTOR CURRENT (A)
10
0.9
IC/IB = 10
dc 1
1s
100 ms
10 ms
1 ms
0.8 IC/IB = 100 0.7
0.1
SINGLE PULSE TA = 25C 0.6 0.001 0.01 0.1 1 IC, COLLECTOR CURRENT (AMPS) 0.01 0.1 1 10 VCE, COLLECTOR EMITTER VOLTAGE (VOLTS)
Figure 5. Base Emitter Saturation Voltage versus Base Current
Figure 6. Safe Operating Area
http://onsemi.com
3
NSL12AW
r(t), MINIMUM PAD NORMALIZED TRANSIENT THERMAL RESISTANCE 1 D = 0.50 D = 0.20 0.1 D = 0.10 D = 0.05 D = 0.02 0.01 D = 0.01 SINGLE PULSE 0.001
0.00001
0.0001
0.001
0.01
0.1 t, TIME (s)
1
10
100
1000
Figure 7. Normalized Thermal Response
PACKAGE DIMENSIONS
A G
SOT-363/SC-88 CASE 419B-02 ISSUE H
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D G H J K N S INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
6
5
4
S
1 2 3
-B-
D 6 PL
0.2 (0.008) N
M
B
M
J C
STYLE 20 PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR
H
K
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-0031 Phone: 81-3-5740-2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
http://onsemi.com
4
NSL12AW/D


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